1. 2. 3. material content data sheet sales product name bsc090n03ms g issued 19. february 2015 ma# MA001336488 package pg-tdson-8-5 weight* 123.54 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.743 0.60 0.60 6018 6018 leadframe non noble metal iron 7439-89-6 0.038 0.03 306 inorganic material phosphorus 7723-14-0 0.011 0.01 92 non noble metal copper 7440-50-8 37.762 30.57 30.61 305668 306066 wire non noble metal copper 7440-50-8 0.059 0.05 0.05 477 477 encapsulation organic material carbon black 1333-86-4 0.097 0.08 787 plastics epoxy resin - 6.899 5.58 55845 inorganic material silicondioxide 60676-86-0 41.588 33.66 39.32 336645 393277 leadfinish non noble metal tin 7440-31-5 1.452 1.18 1.18 11751 11751 plating noble metal silver 7440-22-4 0.166 0.13 0.13 1340 1340 solder noble metal silver 7440-22-4 0.027 0.02 216 non noble metal tin 7440-31-5 0.021 0.02 173 non noble metal lead 7439-92-1 1.019 0.83 0.87 8252 8641 heatspreader non noble metal iron 7439-89-6 0.011 0.01 92 inorganic material phosphorus 7723-14-0 0.003 0.00 28 non noble metal copper 7440-50-8 11.320 9.16 9.17 91632 91752 heat sink clip non noble metal iron 7439-89-6 0.022 0.02 181 inorganic material phosphorus 7723-14-0 0.007 0.01 54 non noble metal copper 7440-50-8 22.292 18.04 18.07 180443 180678 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and contains pb according rohs exemption 7a, lead in high melting temperature type solders. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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